ETPPB (Round)

1. Mfg. Process : Electro plating
2. Composition : ETPPB-S(Phosphor Bronze+Cu+Sn) -> Tin 100%
3. Available Use : Chip, Connector bobbin, Transister bobbin pin, Connector pin, Micro pin
                                 콘넥터보빈용, 트랜지스터 보빈핀용, 콘넥터핀용, 마이크로핀용
4. Plating Thickness : 4±1μ

* Fe/Brass/Cu/PPB/Brass Base Metal 및 Plating 은 고객주문 사양에 따라서
   주문생산, 대응이 가능합니다.(주문시 반드시 명시 바랍니다.)
* Fe/Brass/Cu/PPB/Brass Base Metal and Plating can be customized
   according to the customer's order and standards.
   please specify when ordering.