CP-Wire (Round)

1. Mfg. Process : Electro plating
2. Composition : ETPCS(Fe+Cu+Sn) -> Tin 100%
3. Available Use : Connector bobbin, I.F.T, Transistor Bobbin Pin
                                 콘넥터보빈용, 트랜지스터, IFT 단자용
4. Plating Thickness : 5±1μ, 4±1μ

* Fe/Brass/Cu/PPB/Brass Base Metal 및 Plating 은 고객주문 사양에 따라서
   주문생산, 대응이 가능합니다.(주문시 반드시 명시 바랍니다.)
* Fe/Brass/Cu/PPB/Brass Base Metal and Plating can be customized
   according to the customer's order and standards.
   please specify when ordering.